With
simple depth-milling a standard printed circuit board can be prepared for
flexible installations. So called "semi-flexible" printed circuits
are offering a cost-efficient solution. They save connectors and increase
reliability while decreasing size of the application and time needed for
assembly. Semi-flexible PCBs are the perfect solution if you have
flex-to-install requirements only and there is no dynamic bending during
operation.
Often layout designers are reluctant to upgrade from a
standard PCB with connectors to a notoriously expensive rigid-flexible printed
circuit. The advantages are immense, but so are the costs and the layout
requirements compared to standard PCBs. Many times this "jump" from
standard technology to a high-tech segment is not necessary. Many printed
circuits do not require dynamic bending capabilities in operation but only need
to be fit into the housing neatly. This is called a "flex-to-install"
requirement and here semi-flex offers a really cost-saving alternative
technology.
Production of a semi-flexible PCB is identical with the
manufacturing process of standard printed circuits. Semi-flexilbe boards can be
produced as single-layer, double-layer or multilayer PCBs. With the exemption
of a special solder mask that sustains bending, the materials are also
identical to standard printed circuits. The only difference happens at the end
of the production process when dedicated bending areas are milled down by
z-axis routing. The remaining material can be bend and is thin enough to only
carry the copper traces and little base material.
Design and installation of semi-flexible PCBs require
some attention and modifications:
1.
The PCB should only be bend with copper
on the outside of the bending area.
2.
Open copper structures, pads, annular
rings or vias in the rigid part of the PCB should have a distance of at least 1mm from the bending area. In special
cases 0,8mm are okay, too. The
semi-flexible are cannot contain any vias, drills or open copper structures.
The transition area from flexible to rigid should have a radius of 5mm or an obstuse angle.
Trace-to-outline distance in the semi-flexible area should be minimum 0,30mm .
3.
The maximum bending radius depends on
the lenght of the semi-flexible area:
4.
Currently, semi-flexible PCBs are possible
up to 8 layers, while only one outer layer can be "semi-flexible" per
bending area.
Baggio WANG FAN
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SHENZHEN JAAPSON TECHNOLOGY CO LTD
Building 2, Tongfuyu Industrial Park,Shenzhen, China, 518104
Tel: 86-755-82596922
Fax:86-755-82596922/82596923
skype: baggiowang0214
baggio.wang@funsunpcb.com
baggio@jaapson-pcb.com
www.jaapsonpcb.com
JAAPSON, The Expert in HDI Multi-layer PCBs