For standard circuit boards,
a PCB manufacturer is given a set of patterns - copper patterns, hole patterns,
ink patterns, which are combined into a single circuit board with all the
pattern sizes and positions within certain tolerances. Failure to meet a
certain size or position with the specified tolerance can be cause for the
circuit board to be rejected. If a trace has been defined as an impedance
control trace, it is not the trace size which is strictly defined, but rather
the impedance. While a nominal trace size will be provided in the Gerber layer,
it is understood the circuit board manufacturer can vary trace width, height,
and dielectric thickness as long as the final impedance is within tolerance.
Generally speaking, 3 levels of
service are available for an impedance control printed circuit board.
No impedance control.
The
impedance tolerance is loose enough that simply making a design with no extra
precautions will result in the correct impedance as long as the design is made
correctly within the standard specifications. This is the fastest and least
expensive option since it places no extra burden on the circuit board
manufacturer.
Impedance watching.
The
designer indicates the impedance control trace. The PCB provider adjusts the
(W)width of the trace and (H)height of the dielectric and gets approval on the
proposed specifications before starting manufacturing. A TDR (Time Domain
Reflectometry) test can be performed to confirm the impedance for an additional
cost.
Impedance control.
Usually
reserved for high-end designs containing either an odd design that doesn't fit
the usual microstrip configuration or a tight tolerance. With manufacturing
capability limits approaching the dimension requirements, confidence is not
high the target impedance will be achieved on the first pass. The circuit board
manufacturer first makes the board, getting as close to the target impedance as
possible. Next a TDR test is done to determine if the impedance is within
specification and adjustments are made as necessary. In the example below, the
prepreg (composite fibers "pre-impregnated" with an epoxy) can be
added or removed in 1 mil increments to affect H, and changes can also be made
to W. Multiple iterations may be needed depending on the design.
At
higher frequencies, the impedance will depend on the geometry of the circuit so
it has to be calculated. These calculation are complex.
In
the case of a microstrip, the impedance will depend on 4 parameters :
H is the height of the
dielectric. It can be changed in steps. In this example +/- 1 mil results
in +/- 2 ohms
Er is the dielectric of the
material. It is fixed once the material is chosen. Having a good idea of
the Er is necessary since +/- 0.1 results in +/- 0.5 Ohms. To make things more
complicated, only certain specialty materials like Rogers 4003 have well-defined dielectrics.
T is the trace
thickness. An outer trace is plated, providing a 20% uncertainty in
exterior traces. This results in a small uncertainty of +/-0.2 ohms.
W is the trace
width. Typical trace width uncertainty is +/-2 mil which results in an
uncertainty of +/- 2 ohms.
In the example provided, if the target impedance is 50 ohm, a 26 mil trace width is required. Since there is a tolerance on the input parameters it translates into a tolerance on the trace width. Achieving the calculated trace size should result in the required impedance.
A typical tolerance on final
impedance is +/- 10%.
Achieving
this requires a good understanding of the Er values and experience about how
dielectric laminates behave. Ensure your PCB manufacturer has the knowledge and
capabilities to meet your requirements. Specifying impedance control ensures
you will need to work closer with your circuit board provider but the results are worth it.
Baggio WANG
baggio@jaapson-pcb.com
www.jaapsonpcb.com
skype: baggiowang0214
JAAPSON, Expert in HDI Multi-layer PCB manufacturing
baggio@jaapson-pcb.com
www.jaapsonpcb.com
skype: baggiowang0214
JAAPSON, Expert in HDI Multi-layer PCB manufacturing
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